doc. no : qw0905-LVYVG3392-PF rev. : a date : 12 - apr. - 2007 data sheet durl color led lamps LVYVG3392-PF lead-free parts pb ligitek electronics co.,ltd. property of ligitek only
18.0min 1.anode green 2.common cathode 3.anode yellow note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. -30 2.0min 2.54typ -60 75% 100% directivity radiation 60 50%25%050% 25%75%100% 30 0 2.54typ 2.0min 1.5 max 0.5 typ package dimensions part no. LVYVG3392-PF page 1/6 10.5 0.5 8.6 7.6 vy vg 1 2 3 + 3 - 2 + 1 5.9 5.0 ligitek electronics co.,ltd. property of ligitek only
tstg storage temperature-40 ~ +100 note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. typical electrical & optical characteristics (ta=25 ) page 2/6 i f forward current ma 3030 operating temperature reverse current @5v t opr ir peak forward current duty 1/10@10khz power dissipation pd i fp -40 ~ +85 10 a 120 100 75 60 mw ma parameter symbol absolute maximum ratings at ta=25 absolute maximum ratings vg vy unit ligitek electronics co.,ltd. property of ligitek only electrostatic discharge( * ) esd 2000 --- v * static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. luminous intensity @20ma(mcd) spectral halfwidth nm forward voltage @20ma(v) part no material viewing angle 2 1/2 (deg) peak wave length pnm typ. 390 90 LVYVG3392-PF 565 3050 emitted lens 20 --- 160 max. min.min. 70 70 color dominant wave length dnm 590 --- green algainp gap yellow white diffused 1.7 2.6 1.72.6 part no. LVYVG3392-PF
fig.3 forward voltage vs. temperature ambient temperature( ) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 1.52.02.53.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 typical electro-optical characteristics curve vy chip page 3/6 r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) 500 0.0 0.5 550 600 650 fig.5 relative intensity vs. wavelength 1.0 part no. LVYVG3392-PF
fig.4 relative intensity vs. temperature 1.0 r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) 500 0.0 0.5 550600650 ambient temperature( ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 -40 0.8 -20 1.0 0.9 1.1 1.2 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 80 40 20 060100 0.0 2.5 1.5 1.0 2.0 3.0 ambient temperature( ) -40-2002060 40100 80 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 ligitek electronics co.,ltd. property of ligitek only fig.2 relative intensity vs. forward current typical electro-optical characteristics curve 2.0 fig.1 forward current vs. forward voltage forward voltage(v) 100 f o r w a r d c u r r e n t ( m a ) 1.0 0.1 10 1.0 vg chip 1000 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 3.04.05.0 forward current(ma) 1.0101001000 page 4/6 part no. LVYVG3392-PF
note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only page 5/6 60 seconds max 0 preheat 0 25 2 /sec max 100 50 150 time(sec) temp( c) 120 260 5 /sec max 260 c3sec max part no. LVYVG3392-PF
1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles solderability test 1.t.sol=230 5 2.dwell time=5 1sec thermal shock test solder resistance test 1.t.sol=260 5 2.dwell time= 10 1sec. high temperature high humidity test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. this test intended to see soldering well performed or not. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 the purpose of this test is the resistance of the device under tropical for hours. mil-std-202:103b jis c 7021: b-11 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) test condition operating life test low temperature storage test high temperature storage test test item reliability test: this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 description reference standard ligitek electronics co.,ltd. property of ligitek only page 6/6 part no. LVYVG3392-PF
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